News summary
Tongfu Microelectronics clearly demonstrated its expertise in glass substrate packaging technologyaaanftgameshas confirmed its ability to use TGV substrates for chip packaging.
Newsletter text
[Tongfu Microelectronics has advanced packaging technology] Recently, in response to investors 'inquiries about the company's TGV glass substrate packaging technology, Tongfu Microelectronics revealed that it has corresponding technical reserves and can implement advanced technology for chip packaging using this glass substrate.