levvelfreespins| Hudian shares: Price competition for mid-to-low-end automotive PCBs is expected to become more intense

Category:Entrepreneurship Date: View:25

News summary

[Hudian: Price competition for mid-to-low-end automotive PCBs is expected to become more intense] Securities Times e Company Newslevvelfreespins, Hudian (002463) recently accepted an institutional survey and said that the pace of changes in various disruptive trends such as electrification, intelligence and networking in the automotive industry will not stop, and its technologylevvelfreespins...

Newsletter text

[Hudian Shares: Price competition for mid-to-low-end automotive PCBs is expected to become more intense] Securities Times e Company News, Huidian (002463) recently accepted an institutional survey and stated that the pace of changes in various disruptive trends such as electrification, intelligence and networking in the automotive industry will not stagnate, and its technology upgrade iteration and penetration improvement will provide strong long-term growth opportunities for the automotive panel segment in the direction of multi-layer, high-end HDI, high-frequency and high-speed, high-pressure resistance, high-temperature resistance, and high-integration. To a certain extent, automotive PCBs are characterized by insufficient supply in emerging high-end market segments and oversupply in mid-to-low-end markets. Faced with a more diverse, complex and continuously changing automotive industry, price competition for mid-to-low-end automotive PCBs is expected to become more intense., posing greater challenges and challenges to the hard and soft power of automotive panel manufacturers.